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> Sapphire window piece > The window piece > Sapphire Window piece

Sapphire Window piece

  • Sorts : The window piece

  • Update Time : 2022-09-09
  • Code: YX757032496
  • More 0
Introduction

The properties of Sapphire make it ideal for use in harsh environments. It has an excellent combination of physical, chemical and optical properties that allow sapphire to retain its composition at high temperatures. Sapphires resist acids and bases up to 1000°C and erosion below 300°C. Sapphires are inherently birefringent. Sapphire's transmission ranges from ultraviolet to near-infrared. We do not approve the use of ultrasonic cleaning for any HE observation window. We have cleaned these ultra-high vacuum Windows when we shipped them. If necessary, you can blow dry the glass and remove any HE pollutants with clean and dry air. Baking ramp rate: 20°C per minute observation window -DUVSapphire window slice laser processing in sapphire cutting features: The device is developed for the rapid cutting of sapphire mobile phone window slice, using picosecond laser new technology, compared with the original laser scanning processing has the advantages of fast speed, small edge collapse, no taper and so on. The equipment can cut all kinds of optical glass and brittle materials quickly. The machine adopts picosecond infrared laser with good beam quality, small focusing spot, small power fluctuation, to ensure stable processing quality. The machine can be processed by German 3D galvanometer. It has good 3D processing ability for products with complex shapes and structures such as arc screen, cone, epitaxial half-plane, trapezoid, etc. The GUO effect is as good as that of planar laser. Precision optical path design ensures high quality laser transmission. Equipped with high speed and high precision linear motor. Equipped with automatic processing system, can realize automatic loading and unloading, automatic focus laser cutting, reduce labor costs for customers. Application: Suitable for sapphire lens cap, Home button cutting, glass, silicon, fingerprint module, all kinds of covering film, liquid crystal panel and other materials processing. It can be used in drilling, cutting, etching, marking, grooving and so on. Widely used, flexible processing mode.

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